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  • Symposia
    • A. Coatings for Use at High Temperatures
    • B. Hard Coatings and Vapor Deposition Technologies
    • C. Fundamentals and Technology of Multifunctional Materials and Devices
    • D. Coatings for Biomedical and Healthcare Applications
    • E. Tribology and Mechanical Behavior of Coatings and Engineered Surfaces
    • F. New Horizons in Coatings and Thin Films
    • G. Surface Engineering – Applied Research and Industrial Applications
    • H. Advanced Characterization Techniques for Coatings, Thin Films, and Small Volumes
    • TS1. Anti- and De-icing Surface Engineering
    • TS2. New Horizons in Boron-Containing Coatings: Modeling, Synthesis and Applications
    • TS3. In-silicio Design of Novel Materials by Quantum Mechanics and Classical Methods
    • TS4. Photocatalytic and Superhydrophilic Surfaces
    • TS5. Thin Films on Polymer Substrates: Flexible Electronics and Beyond
  • Short Courses
    • Plasmas in Physical Vapor Deposition, Including Arcs and HiPIMS – 4/26/20
    • In-situ and Ex-situ Ellipsometry Characterizations of Thin Films – 4/26/20
    • NEW! Design and Deposition of Hard and Superhard Coatings – 4/27/20
    • Reactive Magnetron Sputter Deposition – 4/27/20
    • NEW! Atmospheric Pressure Plasma: Principles, Sources and Applications – 4/28/20
    • Practical Thin Film Characterization – 4/28/20
    • Fundamentals of HiPIMS Plasmas for Thin Film Deposition – 4/29/20
    • Nanomechanics and Tribology of Thin Film Coatings – 4/29/20
    • Industrial Surface Engineering: Fundamentals, Practice and Applications – 4/30/20
    • Understanding and Control Stresses in PVD Thin Films – 4/30/20
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TS5. Thin Films on Polymer Substrates: Flexible Electronics and Beyond

Topical Symposium 5

This session focuses on all aspects of material science related to thin films and coatings deposited on polymer substrates as well as metal-polymer and ceramic-polymer composite materials in general. Both fundamental and applied contributions on the following topics are highly welcome:

  • Thin films for flexible electronics applications (conductive, semiconducting, magnetic, barrier layers, encapsulation, etc.)
  • Additive manufacturing and other novel methods for thin film fabrication
  • Atomic layer (ALD) and molecular layer deposition (MLD)
  • Fabrication and properties of metal-polymer / ceramic-polymer composites and interfaces
  • 3D printing of metal-polymer composites
  • Functional and mechanical properties of novel alloys deposited on polymer substrates (high-entropy alloys, metallic glasses, etc.)
  • Flexible and stretchable electronic devices
TS5. Invited Speakers:
  • Denys Makarov, Helmholtz-Zentrum Dresden-Rossendorf e. V. (HZDR), Institute of Ion Beam Physics and Materials Research, Germany, “Flexible Electronics: From Interactive Smart Skins to In vivo Applications”
  • Tina Ng, University of California San Diego, USA, “Printed Flexible Electronics for Biomechanical Measurements”

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Key Dates

ICMCTF Awards Deadline:
October 1, 2019

Late News Abstract Deadline:
February 5, 2020

Early Registration Deadline:
March 20, 2020

Hotel Reservation Deadline:
March 20, 2020

Manuscript Deadline:
March 20, 2020

Downloads

  • Call for Abstracts FlIer
  • Presentation & Poster Guidelines

Contact

ICMCTF
Yvonne Towse

Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
icmctf@icmctf.org

 

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