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  • Short Courses
    • Plasmas in Physical Vapor Deposition, Including Arcs and HiPIMS – 4/26/20
    • In-situ and Ex-situ Ellipsometry Characterizations of Thin Films – 4/26/20
    • NEW! Design and Deposition of Hard and Superhard Coatings – 4/27/20
    • Reactive Magnetron Sputter Deposition – 4/27/20
    • NEW! Atmospheric Pressure Plasma: Principles, Sources and Applications – 4/28/20
    • Practical Thin Film Characterization – 4/28/20
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Reactive Magnetron Sputter Deposition – 4/27/20

Diederik Depla
Professor, Ghent University, Ghent, Belgium

Course Objectives
  • Understand the fundamental processes driving (reactive) magnetron sputtering
  • Develop strategies for dedicated experiments to unravel the complexity of reactive magnetron sputtering
  • To get a good overview of the current literature and modelling techniques.
Course Description

Reactive magnetron sputter deposition is a mature technique often used in laboratories and at industrial level to grow compound thin films. The growth of these films is defined by the deposition conditions, and therefore a good knowledge of the deposition process is essential to tune the growth and as such the film properties.

After a short introduction on the physics of sputtering, the magnetron discharge and the transport of sputtered atoms through the gas phase, the course starts with a few definitions regarding reactive sputtering to show that the processes driving this technique are general applicable. This introduction assists the attendee to the next step : the description of the most common experiment during reactive magnetron sputtering, the hysteresis experiment. The simplicity of this experiment fools initially the scientist because it hides a complex interplay between different processes that define the actual outcome of the experiment. During the course, the details of this experiment are analyzed, and modelling is used to guide the attendee. In this way, the attendee will gain knowledge in a wealth of important process controlling the film growth. A good knowledge of these processes will arm the attendee to analyze and to control the reactive sputtering process.

Course Content
  • Sputtering : physics of sputtering, and transport of sputtered atoms
  • Magnetron discharges : typical features, electron emission, excitation and ionization
  • Hysteresis experiments : what can we learn from this “simple” experiment ?
  • Influence of deposition parameters
  • Dynamics of reactive sputter deposition
  • Arcing
  • Discharge voltage behavior
  • Process parameters and thin film growth
  • Questions and answers
Who should attend?

This course is intended for engineers, scientists, and students Interested in reactive sputter deposition and its applications

Course Materials

Lecture notes will be provided. The handbook “Magnetrons, Reactive Gases and Sputtering” can be purchased from the instructor at net cost price.

Date/Time: Monday, April 27, 8:30 a.m.-4:30 p.m.
Cost: $500 Regular/$130 Student

Short Course Registration

All short courses include detailed course notes, morning and afternoon breaks. Lunch is not included in the course registration fee.

Courses run from 8:30 a.m. to 4:30 p.m.

Individual and Company Group discounts available!

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Key Dates

ICMCTF Awards Deadline:
October 1, 2019

Late News Abstract Deadline:
February 5, 2020

Early Registration Deadline:
March 20, 2020

Hotel Reservation Deadline:
March 20, 2020

Manuscript Deadline:
March 20, 2020

Downloads

  • Call for Abstracts FlIer
  • Presentation & Poster Guidelines

Contact

ICMCTF
Yvonne Towse

Conference Administrator
125 Maiden Lane; Suite 15B
New York, N.Y. 10038
icmctf@icmctf.org

 

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